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UV Debonding Machine

TS33030-405 UVLED Debonding Machine

Voltage input: AC 110 V 15A (800W)
Equipment size: 750*636*500mm
UV wavelength: 405nm
Effective area: 300mm*300mm
Plate size: 12-inch wafer, height 10mm
Light output intensity: 300mW/cm2
Control module: HMI touch interface
Energy control: 10%~100%
High pressure axial fan cooling
Temperature self-protection device and warning function
Can be connected to PLC
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specification

Voltage input: AC 110 V 15A (800W)
Equipment size: 750*636*500mm
UV wavelength: 405nm
Effective area: 300mm*300mm
Plate size: 12-inch wafer, height 10mm
Light output intensity: 300mW/cm2
Control module: HMI touch interface
Energy control: 10%~100%
High pressure axial fan cooling
Temperature self-protection device and warning function
Can be connected to PLC